When required by the customer, Xsis Oscillators can be subjected to the following screening tests on a 100% basis.  PDA for Burn-in & Non-Destruct Bond Pull are in accordance with the requirements of MIL-PRF-55310 for "Class S" products.

HI-REL   SCREENING

( Similar to MIL-PRF-55310, "Class S" Screening )
Non-Destruct Bond Pull MIL-STD-883, Method 2023 ( PDA=2% or 1 wire whichever is greater )
Internal Visual MIL-STD-883, Method 2017, Class "S", Except Class "B" for Elements
Stabilization Bake MIL-STD-883, Method 1008, Cond. C, 48 Hours Minimum
Thermal Shock MIL-STD-883, Method 1011, Cond. A
Temperature Cycling MIL-STD-883, Method 1010, Cond. B
Constant Acceleration MIL-STD-883, Method 2001, Cond. A, Y1 only, ( 5000 G )
Seal - fine & gross leak MIL-STD-883, Method 1014
PIND MIL-STD-883, Method 2020, Cond. A
Radiographic Insp. MIL-STD-883, Method 2012
Electrical TestsMIL-PRF-55310, Class B
Burn-in +125 °C, Nominal Supply Voltage & Burn-in Load, 320 Hours Min.
Electrical TestsMIL-PRF-55310, Class B
Updated Apr 8, 2014
Xsis Electronics Inc.  • 12620 Shawnee Mission Pkwy  •  Shawnee  •  Kansas  •  66216
Tel: 913-631-0448   ·   Fax: 913-631-1170   ·   e-mail:  xsis@xsis.com